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Intel Developer Forum, San Francisco, California. – Today, Intel President and CEO Paul Otellini outlined new products, microprocessors, and manufacturing technologies that will allow the corporation to continue its path of leadership in products and technology.
As part of the Intel Developer Forum (IDF), Otellini demonstrated to industry-leading companies—manufacturers and developers—the first chips in the industry created using a
32-nm process node, based on transistors so small that 4 million of them could fit on the period at the end of this sentence.
Otellini also described the advantages of upcoming products—the processor family codenamed Penryn, manufactured using a 45-nm process node and based on revolutionary metal gate and high-k dielectric transistor manufacturing technology. Intel Corporation will begin shipping the industry's first processors manufactured using the 45-nm process in November. The corporation also demonstrated for the first time the next-generation microprocessor architecture codenamed Nehalem, with system development based on it beginning next year.
“Our consistent strategy of making changes to modern processor manufacturing technologies and microprocessor architectures—year after year—allows us to accelerate the introduction of innovations into the industry,” Otellini stated. “Consistency is the engine that allows for the creation of today's most advanced technologies and ensures their rapid implementation. Our customers and users worldwide can rely on Intel Corporation's innovation engine and its manufacturing capabilities, which provide a modern level of performance that is rapidly becoming more widespread.”
When Intel releases the Penryn processors in November, they will be the first processors manufactured using the 45-nm process intended for mass production. Penryn processors, as well as Silverthorne processors manufactured using the 45-nm process (shipping next year), will feature compact size, low power consumption, and high performance, allowing them to be used for a wide range of computing tasks—from portable computers with Internet access to high-end servers. Intel Corporation will rapidly reach a high technological level by releasing 15 new processors
(and another 5 in the first quarter of 2008) across all market segments using the 45-nm process by the end of this year, thereby strengthening its leadership in performance and power efficiency. Currently, Intel's Penryn processors have already become the basis for more than 750 systems being designed by leading industry companies.
“We expect that Penryn processors will be able to provide a performance increase of at least 20% while simultaneously increasing power efficiency,” Otellini said. “Intel's advanced 45-nm process technology allows us to produce affordable, ultra-low-power processors for use in devices with compact form factors, as well as create high-performance multi-core processors with broad functionality for use in the most advanced systems.”
Additionally, Otellini announced that starting in 2008, processors manufactured using the 45-nm process and chipsets created using the 65-nm process will be produced using halogen-free packaging technologies. This, along with the use of lead-free packaging technology and metal gate high-k transistor manufacturing technology, will allow the next generation of Intel processors to achieve increased power efficiency and sharply reduce the negative environmental impact of production.
Regarding the release of new products in 2008, Otellini conducted the first public demonstration of an Intel processor codenamed Nehalem and stated that the company intends to begin shipping processors based on the new microarchitecture in the second half of next year. The Nehalem architecture will strengthen Intel processors' leadership in benchmarks measuring performance and performance-per-watt ratios, and processors based on it will be the first Intel processors to support the QuickPath Interconnect system architecture. The QuickPath architecture will include integrated memory controller technology and improved connections between system components, which will significantly increase overall system performance.
“The Nehalem architecture is a completely new microarchitecture that continues the 'traditions' of the Intel Core microarchitecture, providing extremely high performance and power efficiency, as well as new opportunities for the server market—and this comes just one year after Intel moves the industry to the 45-nm process,” Otellini stated.
Paul Otellini also demonstrated the world's first 300-millimeter wafer built using the next-generation 32-nm process. The development of high-tech chips serves as an important milestone toward Intel's mass production of processors manufactured using the 32-nm process. With the start of 32-nm processor production in 2009, Intel Corporation will be able to maintain its leading position in the industry, defined by the development of the most advanced manufacturing technologies.
Fully functional Intel chips manufactured using the 32-nm process combine logic elements and static random-access memory (SRAM) devices, containing more than 1.9 billion transistors. The 32-nm process uses next-generation metal gate high-k transistors.
“To effectively meet growing demands for computer performance, we need to rapidly transition to a new manufacturing technology,” Otellini stated. “Intel Corporation's engineers and researchers deserve great praise for the milestones achieved in industry development. As our latest technologies reach users and organizations over the next few years, the computing power they can utilize will be even more productive, creative, and innovative.”
Otellini also announced that a dual-core version of the Penryn processor with 25 W power consumption will be released as part of the upcoming mobile platform codenamed Montevina with WiMAX support. Several hardware manufacturers plan to start releasing laptops based on the Montevina platform as early as next year, once the platform is fully implemented. Overall, it is expected that WiMAX standard wireless networks could cover areas inhabited by more than 1 billion people by 2012.
According to Intel Corporation data, access to WiMAX wireless networks, along with Intel's efforts to provide developing countries with computer technology under the Intel World Ahead program and innovative products such as the Silverthorne processor family, will create opportunities for another billion people worldwide to use computers.
Link to website http://www.intel.com
The demonstration was traditional: a 300 mm semiconductor wafer was shown with SRAM chips manufactured using 32 nm technology, utilizing high-k dielectric transistors based on hafnium and a metal gate. That is, effectively, it can be said that the memory chips shown were the industry's first working 32 nm devices. However, as a reminder, Intel always shows such SRAM chips made to new technological standards approximately one year before the start of trial CPU production. By the way, according to existing plans, shipments of the first 32 nm processors should begin in the second half of 2009.
As for the characteristics of the shown 32 nm SRAM chips, they contained more than 1.9 billion transistors each and had a capacity of 291 Mbit.
The 32 nm process node will be used by Intel to produce an improved version of Nehalem coming in 2009, known by the codename Westmere. Additionally, the Sandy Bridge processor with a new microarchitecture planned for 2010 is also intended to be produced using 32 nm technology
Info from website http://www.overclockers.ru
As part of the Intel Developer Forum (IDF), Otellini demonstrated to industry-leading companies—manufacturers and developers—the first chips in the industry created using a
32-nm process node, based on transistors so small that 4 million of them could fit on the period at the end of this sentence.
Otellini also described the advantages of upcoming products—the processor family codenamed Penryn, manufactured using a 45-nm process node and based on revolutionary metal gate and high-k dielectric transistor manufacturing technology. Intel Corporation will begin shipping the industry's first processors manufactured using the 45-nm process in November. The corporation also demonstrated for the first time the next-generation microprocessor architecture codenamed Nehalem, with system development based on it beginning next year.
“Our consistent strategy of making changes to modern processor manufacturing technologies and microprocessor architectures—year after year—allows us to accelerate the introduction of innovations into the industry,” Otellini stated. “Consistency is the engine that allows for the creation of today's most advanced technologies and ensures their rapid implementation. Our customers and users worldwide can rely on Intel Corporation's innovation engine and its manufacturing capabilities, which provide a modern level of performance that is rapidly becoming more widespread.”
When Intel releases the Penryn processors in November, they will be the first processors manufactured using the 45-nm process intended for mass production. Penryn processors, as well as Silverthorne processors manufactured using the 45-nm process (shipping next year), will feature compact size, low power consumption, and high performance, allowing them to be used for a wide range of computing tasks—from portable computers with Internet access to high-end servers. Intel Corporation will rapidly reach a high technological level by releasing 15 new processors
(and another 5 in the first quarter of 2008) across all market segments using the 45-nm process by the end of this year, thereby strengthening its leadership in performance and power efficiency. Currently, Intel's Penryn processors have already become the basis for more than 750 systems being designed by leading industry companies.
“We expect that Penryn processors will be able to provide a performance increase of at least 20% while simultaneously increasing power efficiency,” Otellini said. “Intel's advanced 45-nm process technology allows us to produce affordable, ultra-low-power processors for use in devices with compact form factors, as well as create high-performance multi-core processors with broad functionality for use in the most advanced systems.”
Additionally, Otellini announced that starting in 2008, processors manufactured using the 45-nm process and chipsets created using the 65-nm process will be produced using halogen-free packaging technologies. This, along with the use of lead-free packaging technology and metal gate high-k transistor manufacturing technology, will allow the next generation of Intel processors to achieve increased power efficiency and sharply reduce the negative environmental impact of production.
Regarding the release of new products in 2008, Otellini conducted the first public demonstration of an Intel processor codenamed Nehalem and stated that the company intends to begin shipping processors based on the new microarchitecture in the second half of next year. The Nehalem architecture will strengthen Intel processors' leadership in benchmarks measuring performance and performance-per-watt ratios, and processors based on it will be the first Intel processors to support the QuickPath Interconnect system architecture. The QuickPath architecture will include integrated memory controller technology and improved connections between system components, which will significantly increase overall system performance.
“The Nehalem architecture is a completely new microarchitecture that continues the 'traditions' of the Intel Core microarchitecture, providing extremely high performance and power efficiency, as well as new opportunities for the server market—and this comes just one year after Intel moves the industry to the 45-nm process,” Otellini stated.
Paul Otellini also demonstrated the world's first 300-millimeter wafer built using the next-generation 32-nm process. The development of high-tech chips serves as an important milestone toward Intel's mass production of processors manufactured using the 32-nm process. With the start of 32-nm processor production in 2009, Intel Corporation will be able to maintain its leading position in the industry, defined by the development of the most advanced manufacturing technologies.
Fully functional Intel chips manufactured using the 32-nm process combine logic elements and static random-access memory (SRAM) devices, containing more than 1.9 billion transistors. The 32-nm process uses next-generation metal gate high-k transistors.
“To effectively meet growing demands for computer performance, we need to rapidly transition to a new manufacturing technology,” Otellini stated. “Intel Corporation's engineers and researchers deserve great praise for the milestones achieved in industry development. As our latest technologies reach users and organizations over the next few years, the computing power they can utilize will be even more productive, creative, and innovative.”
Otellini also announced that a dual-core version of the Penryn processor with 25 W power consumption will be released as part of the upcoming mobile platform codenamed Montevina with WiMAX support. Several hardware manufacturers plan to start releasing laptops based on the Montevina platform as early as next year, once the platform is fully implemented. Overall, it is expected that WiMAX standard wireless networks could cover areas inhabited by more than 1 billion people by 2012.
According to Intel Corporation data, access to WiMAX wireless networks, along with Intel's efforts to provide developing countries with computer technology under the Intel World Ahead program and innovative products such as the Silverthorne processor family, will create opportunities for another billion people worldwide to use computers.
Link to website http://www.intel.com
The demonstration was traditional: a 300 mm semiconductor wafer was shown with SRAM chips manufactured using 32 nm technology, utilizing high-k dielectric transistors based on hafnium and a metal gate. That is, effectively, it can be said that the memory chips shown were the industry's first working 32 nm devices. However, as a reminder, Intel always shows such SRAM chips made to new technological standards approximately one year before the start of trial CPU production. By the way, according to existing plans, shipments of the first 32 nm processors should begin in the second half of 2009.
As for the characteristics of the shown 32 nm SRAM chips, they contained more than 1.9 billion transistors each and had a capacity of 291 Mbit.
The 32 nm process node will be used by Intel to produce an improved version of Nehalem coming in 2009, known by the codename Westmere. Additionally, the Sandy Bridge processor with a new microarchitecture planned for 2010 is also intended to be produced using 32 nm technology
Info from website http://www.overclockers.ru
